Wafer Level 3-D ICs Process Technology
by Unknown
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403.66 zł
Opis książki
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Szczegóły książki
Autor
Unknown
Wydawnictwo
Springer US
Rok wydania
2009
ISBN
9780387765341
Dostępne formaty
eBook (PDF, EPUB)
Audiobook (MP3)
Język
Polski